guod
Well-Known Member
i know my shit...^^^No, not flip chips are coming soon, WLP using flip chips. Improved whites, COBs and such. Got it?
WLP using flip chips is also not new, just a special form of CSP(Chip Scale package)
"CSP in its smallest form can be a Flip Chip device also referred to as Wafer Level Packaging.(WLP)"
http://www.ledinside.com/knowledge/2013/12/philips_lumileds_chip_scale_packaging_for_leds
this makes only the produktion cheaper. it does not improved whites.
from your link...
"This WLP technique offers many benefits beyond the typical emitter or chip-on-board (COB) packaging available today. Bulk processing is moving in this direction for efficacy, uniformity, and low cost."
improved whites...
"To reach this market ideal, manufacturers would start out with a uniform blue LED wafer with a wavelength uniformity between 2 and 2.5 nm in wavelength, or 1 SDCM as converted through the phosphor. A phosphor film that is also uniform to 1 SDCM is laid over the entire wafer, which is then diced up into individual LED chips. With this process, every chip matches each other within 2 SDCM. There would be no need to sort the chips further, since each one is essentially uniform. While this process creates a path to this industry goal, the technology must still make substantial progress before we can claim to have achieved it."