LED Companies w/ LINKS
- Thread starter Beefbisquit
- Start date
BOBBY_G
Well-Known Member
look at their new 100w replacement A19 bulbs ~115-135 lm/watt with the cover off
Fastslappy
Well-Known Member
I did the same over 15 years ago changed the whole house over with Feit CFL from incandescent by a year later all Feit had failed soo all that 'saving with efficiency ' went into the trash . I was a early adopter as I installed solar panels at the same time & was trying to reduce my load of lighting wattage by going to CFL
which did reduce my yearly use into a break even mode
the once burned thingy 4 me with Feit as a company
FranJan
Well-Known Member
Feit Schmeit! Let's get our eyes back on the prize ladies 
. So is 2016 the beginning of the end for our dear COBs?
COBs r sooooo dead. Long live CSP/PoW LEDs! LOL
Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
Samsung’s CSP technology significantly scales down the size of a conventional LED package by combining advanced flip chip** technology with phosphor coating technology, thereby eliminating any need for metal wires and plastic molds. This shift enables more flexible and compact designs when manufacturing LED lighting modules or fixtures, and lowers the production and operational costs of LED lighting systems. Samsung’s CSP products also allow for flexibility in adjusting the size of the light-emitting surface and its associated luminance level, to meet the diverse requirements of a wide variety of lighting applications including bulbs, spot lighting, downlighting and street lighting.
“Our new CSP products overcome what had been significant performance limitations of conventional LED packages. By expanding our CSP line-up, we expect to provide greater value to the LED lighting market, enabling new possibilities in LED lighting and giving our customers greater design flexibility,” said Jacob Tarn, Executive Vice President, LED Business Team, Samsung Electronics. “We are aggressively innovating through the introduction of well-differentiated LED components, while further strengthening our presence in the LED marketplace in terms of technology and cost.”
The new CSP line-up has been fortified with a wide range of operating current options from 0.6W to 3W and even 10W LED packages. The new packages complete Samsung’s CSP technology roadmap, which was announced at LIGHTFAIR International 2015 when the company’s CSP technology commercialization plan was unveiled.
High-power, 3W-class CSP LED package – LH181A
The LH181A is a high-power CSP package that features approximately 12 percent higher luminous flux*** at a maximum current of 1.5A, compared to Samsung’s 3W-class ceramic-based high-power LED package. The LH181A offers a high luminous flux, typically at around 162lm/W (@350mA, Ra70, 5000K).
Each LH181A measures 1.91x1.91mm, which is about 30 percent smaller than Samsung’s ceramic-based LED solution. The package’s ultra-small size enables much smaller lighting designs and better lm/$ (lumens per dollar) value that can be especially useful in outdoor and spot lighting applications.
The LH181A provides a wide beam angle of 140 degrees making it also applicable to street lighting by adding a lens as a secondary optic solution.
CSP Arrays – LH204A & LH309A
Samsung’s CSP arrays, the LH204A and the LH309A, are high-power LED solutions with an operating wattage range from 5W to 10W. The LH204A is a 2x2 array of CSP LED chips that delivers 12V at a 5W-class operating wattage, while the LH309A is a 3x3 chip array offering 26V at a 10W-class operating wattage.
The CSP arrays provide high light quality by adhering a single phosphor to the FX (flexible) circuit board on which tiny CSP LED chips with low thermal resistance are arranged. The use of a thin flexible-film FX circuit board accentuates the thin design of the arranged CSP LED chips. The CSP arrays are suitable for spotlighting applications where high light quality is required from a single light source.
Next-generation CSP solution - PoW (Phosphor-on-Wafer) LED package
Samsung’s Phosphor-on-Wafer (PoW) LED package technology embraces the advantages of CSP LED packaging, while overcoming limitations of cost reduction by upgrading the chip manufacturing process through the use of 8-inch GaN-on-Si wafers instead of 4-inch sapphire wafers. This transition will enable a higher quality CSP LED package by eliminating the chip rearrangement process. The reason for this is that the phosphors can be directly coated on the surface of the GaN-on-Si wafers before being diced, while sapphire wafers have to be cut into chips first and then rearranged to be coated with phosphor.
By simplifying the LED component manufacturing process and improving LED package quality, the PoW LED package technology is expected to contribute significantly to the growth of the LED lighting industry.
Samsung has already applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices since several years ago. Samsung also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of this year.
Samsung will showcase the new CSP products and technologies at the Light + Building 2016 event under the theme “Lighting & Beyond” in Frankfurt, Germany, March 13th – 18th. Visit Booth B04, Hall6.2 to learn more about Samsung’s differentiated LED technologies and innovative component solutions.
The full line-up of Samsung’s CSP includes:
LM101A
149lm/W
Mass production in January 2016
Bulb, High Bay, Spot, D/L
LM102A
135lm/W
Mass production in March 2016
Bulb, High Bay, Spot, D/L
LH181A
162lm/W
Q2 2016
Street, Tunnel, High Bay
LH204A, LH309A
124lm/W, 127lm/W
Q2 2016
MR, PAR, D/L
PoW
8in Wafer technology
Q4 2016
All
. So is 2016 the beginning of the end for our dear COBs?
COBs r sooooo dead. Long live CSP/PoW LEDs! LOL
Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a full line-up of chip-scale LED packages* (CSP), including 0.6W-class and 3W-class packages, CSP arrays, and PoW (Phosphor on Wafer) packages.
Samsung’s CSP technology significantly scales down the size of a conventional LED package by combining advanced flip chip** technology with phosphor coating technology, thereby eliminating any need for metal wires and plastic molds. This shift enables more flexible and compact designs when manufacturing LED lighting modules or fixtures, and lowers the production and operational costs of LED lighting systems. Samsung’s CSP products also allow for flexibility in adjusting the size of the light-emitting surface and its associated luminance level, to meet the diverse requirements of a wide variety of lighting applications including bulbs, spot lighting, downlighting and street lighting.
“Our new CSP products overcome what had been significant performance limitations of conventional LED packages. By expanding our CSP line-up, we expect to provide greater value to the LED lighting market, enabling new possibilities in LED lighting and giving our customers greater design flexibility,” said Jacob Tarn, Executive Vice President, LED Business Team, Samsung Electronics. “We are aggressively innovating through the introduction of well-differentiated LED components, while further strengthening our presence in the LED marketplace in terms of technology and cost.”
The new CSP line-up has been fortified with a wide range of operating current options from 0.6W to 3W and even 10W LED packages. The new packages complete Samsung’s CSP technology roadmap, which was announced at LIGHTFAIR International 2015 when the company’s CSP technology commercialization plan was unveiled.
High-power, 3W-class CSP LED package – LH181A
The LH181A is a high-power CSP package that features approximately 12 percent higher luminous flux*** at a maximum current of 1.5A, compared to Samsung’s 3W-class ceramic-based high-power LED package. The LH181A offers a high luminous flux, typically at around 162lm/W (@350mA, Ra70, 5000K).
Each LH181A measures 1.91x1.91mm, which is about 30 percent smaller than Samsung’s ceramic-based LED solution. The package’s ultra-small size enables much smaller lighting designs and better lm/$ (lumens per dollar) value that can be especially useful in outdoor and spot lighting applications.
The LH181A provides a wide beam angle of 140 degrees making it also applicable to street lighting by adding a lens as a secondary optic solution.
CSP Arrays – LH204A & LH309A
Samsung’s CSP arrays, the LH204A and the LH309A, are high-power LED solutions with an operating wattage range from 5W to 10W. The LH204A is a 2x2 array of CSP LED chips that delivers 12V at a 5W-class operating wattage, while the LH309A is a 3x3 chip array offering 26V at a 10W-class operating wattage.
The CSP arrays provide high light quality by adhering a single phosphor to the FX (flexible) circuit board on which tiny CSP LED chips with low thermal resistance are arranged. The use of a thin flexible-film FX circuit board accentuates the thin design of the arranged CSP LED chips. The CSP arrays are suitable for spotlighting applications where high light quality is required from a single light source.
Next-generation CSP solution - PoW (Phosphor-on-Wafer) LED package
Samsung’s Phosphor-on-Wafer (PoW) LED package technology embraces the advantages of CSP LED packaging, while overcoming limitations of cost reduction by upgrading the chip manufacturing process through the use of 8-inch GaN-on-Si wafers instead of 4-inch sapphire wafers. This transition will enable a higher quality CSP LED package by eliminating the chip rearrangement process. The reason for this is that the phosphors can be directly coated on the surface of the GaN-on-Si wafers before being diced, while sapphire wafers have to be cut into chips first and then rearranged to be coated with phosphor.
By simplifying the LED component manufacturing process and improving LED package quality, the PoW LED package technology is expected to contribute significantly to the growth of the LED lighting industry.
Samsung has already applied its PoW technology to 4-inch wafers in flash LED packages for mobile devices since several years ago. Samsung also plans to utilize the PoW technology for its new CSP product line-up for lighting applications by the end of this year.
Samsung will showcase the new CSP products and technologies at the Light + Building 2016 event under the theme “Lighting & Beyond” in Frankfurt, Germany, March 13th – 18th. Visit Booth B04, Hall6.2 to learn more about Samsung’s differentiated LED technologies and innovative component solutions.
The full line-up of Samsung’s CSP includes:
LM101A
149lm/W
Mass production in January 2016
Bulb, High Bay, Spot, D/L
LM102A
135lm/W
Mass production in March 2016
Bulb, High Bay, Spot, D/L
LH181A
162lm/W
Q2 2016
Street, Tunnel, High Bay
LH204A, LH309A
124lm/W, 127lm/W
Q2 2016
MR, PAR, D/L
PoW
8in Wafer technology
Q4 2016
All
FranJan
Well-Known Member
????? C'mon P. Can u really say that? There's always a new generation of tech and then someone comes along and figures out how to leverage it. Fuck COBs, I count the days till they die and I'm also counting the days till June so I can upgrade my Veros
. The only people who think COBs are here to stay are the ones with inventory 
.Look at Fluence, they went white but leveraged a different tech to do it. Assuming the fucking thing works of course
. Medium power intrigues me more than COBs now so I'm eager to see what Fluence figured out. Plus increases in CSP performance is much faster than COB's increases. Better performance and less cooling needed coming to a growroom near us sooner or later. Sorry but IMHO COBs are nothing more than a waypoint, they are far from perfect, especially for growing but a few people recognized their potential and here we are but give us a 180 LpW square CSP with chip level optics by next year and all the clones will be like COB who I bet ?
Greengenes707
Well-Known Member
All I have to say is
Nichia
Nichia
PSUAGRO.
Well-Known Member
Never said their perfect, no tech is..............lots of assumptions^^^................... will see????? C'mon P. Can u really say that? There's always a new generation of tech and then someone comes along and figures out how to leverage it. Fuck COBs, I count the days till they die and I'm also counting the days till June so I can upgrade my Veros
Look at Fluence, they went white but leveraged a different tech to do it. Assuming the fucking thing works of course
have a great sunday
What about nichia?..........fill us in friend
Greengenes707
Well-Known Member
Mid power leds...Nichia's pall park
White leds...Nichia
Leveraging smaller packages...Nichia.
Fluence leveraging?...more like AT with Nichia leveraging in 2010....and yet to upgrade since 2012. They haven't been sitting on their asses I can tell you that.
FranJan
Well-Known Member
LOL Your entire preceding statement is your opinion based on an assumption. LOL. I'm basing my opinion on what I read and hear. CSP performance increases are much more constant than COBs ever were and since it's a newer tech based on COBs with several design/manufacturing improvements that's only natural.
Methinks sometimes you like to bust my ass too much and it gets the better of you. And if I may steal a bit from Douglas Adams, I never did get the hang of Sundays, but for you today P I will try
.Dude the only thing Nichia is inventing is novel ways to sue companies and people all over the world
.I have been looking at small les cobs (vero 10, 13, 15, cree 1820, 2540) for a special purpose light, but was disappointed with efficiencies.
Are there nichia white leds that might be more efficient, around a vero 10 or vero 13 sizing ?
FranJan
Well-Known Member
http://www.ledinside.com/products/2015/6/samsung_introduces_cob_led_packages_with_small_les_and_advanced_color_quality
"Samsung has introduced three small LES COB packages (LC010C, LC020C and LC040C) to satisfy the market need for higher light intensity with very small form factors"
Also see Luxeon, they always talk up their light's output from their smaller LES.
http://www.lumileds.com/products/cob-leds/luxeon-cob
for Samsung 110lm/watt, like so what ?
Lumileds cobs might be a good option, waiting for availability, some real pricing info and what efficiencies will REALLY be available.
still wondering about nichia, website is hard to glean info.
PSUAGRO.
Well-Known Member
Not busting your ass or wanting to fightLOL Your entire preceding statement is your opinion based on an assumption. LOL. I'm basing my opinion on what I read and hear. CSP performance increases are much more constant than COBs ever were and since it's a newer tech based on COBs with several design/manufacturing improvements that's only natural.
Methinks sometimes you like to bust my ass too much and it gets the better of you. And if I may steal a bit from Douglas Adams, I never did get the hang of Sundays, but for you today P I will try
Dude the only thing Nichia is inventing is novel ways to sue companies and people all over the world
cob's #s,specs, and grows are known/documented here==== what assumptions?
your samsung high lm/w csp chips aren't even released yet(q2 2016) with ZERO grows
bitch to the absurd USPTO, not nichia
edit: You think the diy crowd is going back to soldering more/smaller chips as cobs efficacy rates continue to increase while maintaining it's easy installation/simple circuitry? lol, their NOT going anywhere or dying off as a package..........efficient horti cobs will be next,trust me
======I'm betting on O$ram
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guod
Well-Known Member
one of the best sites
3 clicks and you have all warm white COBs; for example
and than the info... what are you want more
agree they have a lot of great tech info ONCE you figure out where it is.
try browsing for comparative data between different les sizes and color temps to help me find the sweet spots. Only way I could figure out how to do that is to randomnly hunt and peck.
FranJan
Well-Known Member
Can't debate anymore. Seems I'm on probation for what I said to Stevied Wonder and I can't get consistently connected when I sign in. You and I are not on the same page btw. We'll finish this later.Not busting your ass or wanting to fight
cob's #s,specs, and grows are known/documented here==== what assumptions?
your samsung high lm/w csp chips aren't even released yet(q2 2016) with ZERO grows
bitch to the absurd USPTO, not nichia
edit: You think the diy crowd is going back to soldering more/smaller chips as cobs efficacy rates continue to increase and maintaining it's easy installation/simple circuitry? lol, their NOT going anywhere or dying off as a package..........efficient horti cobs will be next,trust me
