on the topic of heat-sinks has anyone done a lapping test with the veros as they have a copper base and i know you prob cant do it with a cree as ceramic but a led chip and heatsink that was lapped to the point that they both sick together with no paste and will give the best thermal conductivity behond what paste can do and lower temps and gain proformance ,,,,,,just a thought as as hard-core pc gaming overclockers have been doing it with there cpu processors for years with clear benefits of cooler running chips with longer life spans.